عنوان
پدید آورنده
موضوع
رده
TK 7870 .15 .P42 1994
TK
7870
.
15
.
P42
1994
کتابخانه
محل استقرار
112217
112218
تابستان۶۷
English
)50(
Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability
New York
Wiley
1994
xxxi, 426 p. : ill. ; 25 cm
A Wiley-Interscience publication
Includes bibliographical references and index
، Electronic packaging-- Design
، Hybrid integrated circuits-- Design and construction
، Multichip modules )Microelectronics(-- Design and construction
TK
7870
.
15
.
P42
1994
TI
]edited by[ Michael Pecht
AU .leahciM ,thceP
05
05
